Advanced engineering suite

Work that happens below the level of a part swap.

Each of these repairs is carried out on the board or the assembly itself — diagnosed first, quoted before anything begins.

01

Motherboard microsoldering

When a phone stops charging, loses a display rail or draws current the moment it is powered, the fault usually sits on the main board rather than in a replaceable part. We trace the rails and data lines at component level and repair the board itself.

  • Short and open tracing across power rails
  • Micro-jumper repair of broken traces and lifted pads
  • Replacement of individual filters, resistors and connectors
  • Board-level diagnosis after liquid exposure
02

CPU and memory reballing

Large chips are soldered to the board through a grid of microscopic spheres. Drop damage, heat and previous repairs break those joints. We remove the package, reball it and reflow it back onto the board.

  • Removal and reballing of BGA packages — CPU, NAND, memory
  • Reflow of weakened or cracked solder joints
  • Pad and via repair after impact damage
  • Rebuild of previously attempted or damaged repairs
03

Data recovery

Recovery starts with the board. Where a device is dead, the repair that gets it talking again is what makes the data reachable — and where it can't be, the storage chip itself is the target.

  • Recovery from water-damaged and non-booting boards
  • Board-level repair as the route into the storage
  • Chip-level work where a standard recovery isn't possible
  • An assessment of what can be recovered before work begins
04

Face ID repairs

Face ID is one of the most delicate assemblies in a modern phone: an infrared projector, an illuminator and a camera, all paired to the board. Damage to the module, its flex or the circuitry behind it stops it working.

  • Dot projector, flood illuminator and IR camera faults
  • Flex and connector damage on the TrueDepth assembly
  • Board-level repair of the Face ID circuitry
  • Alignment and re-seal once the repair is complete
05

OLED screen refurbishment

Not every display fault means a new panel. Where the panel itself is sound and the failure sits in the layers, the flex or the bonding between them, the assembly can be restored rather than replaced.

  • Delamination and touch-layer separation
  • Flex re-bonding on the display assembly
  • Brightness and colour uniformity restoration
  • Glass and frame rebuild around a sound panel
06

Green-line screen repairs

Vertical and horizontal lines across a display usually come from the driver circuitry or the flex that carries the signal, not from a broken panel. Repairing that connection can resolve the fault without a full screen replacement.

  • Vertical and horizontal line faults
  • Driver IC and display flex re-bonding
  • Work carried out where the glass and panel are otherwise intact
  • An honest assessment before replacement is recommended
07

Charging IC and power management

A phone that won't charge, heats up, or refuses to boot is often a power-management problem rather than a dead device. These are small chips with exacting tolerances, repaired at the component level.

  • Charging IC and power-management IC replacement
  • USB controller and charging-circuit faults
  • Short-circuit tracing and rail restoration
  • No-boot and boot-loop diagnosis
08

Game console motherboard repair

Consoles fail in the same places as phones — power rails, ports, and their own large processors — and they respond to the same component-level approach.

  • HDMI port replacement and signal tracing
  • Power rail and regulator faults
  • No-power and no-video diagnosis
  • Overheating and thermal faults

Not sure which of these you need?

Describe what the device is doing and a technician will work out where the fault sits — with a written price before any work starts.